Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Patent
1998-06-30
2000-10-24
Hardy, David
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Outside periphery of package having specified shape or...
257786, 257773, H01L 23535
Patent
active
061371734
ABSTRACT:
An integrated circuit device comprised of a backlapped integrated circuit (IC) and a molding compound. The molding compound is deemed to be secure if it is made of a material which, when tampered, increases the likelihood of damaging a portion of the IC. Otherwise, the molding compound is deemed to be non-secure. This molding compound substantially surrounds the backlapped IC in order to prevent unwanted and unauthorized physical analysis.
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Hardy David
Intel Corporation
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