Press-contact type semiconductor devices

Details Press-contact type semiconductor devices Press-contact type semiconductor devices

1995-09-11

1997-03-11

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With large area flexible electrodes in press contact with...

257723, 257788, H01L 2348

Patent

active

056104391

ABSTRACT:
A press-contact type semiconductor device having multiple semiconductor substrates, a periphery of which being enclosed by a chip frame of insulating resin a first electrode plate and a second electrode plate. The semiconductor substrates are arranged on a plane so as to abut against the chip frame. The semiconductor substrates are press-contacted from the upper and the lower sides by the first electrode plate and the second electrode plate.

REFERENCES:
patent: 4647959 (1987-03-01), Smith
patent: 5250821 (1993-10-01), Ferla et al.
patent: 5267867 (1993-12-01), Agahdel et al.

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