LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

IC package with capacitors disposed on an interposal layer

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

IC package with dual heat spreaders

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

IC package with dual heat spreaders

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

IC package with electric conductor lines in dielectric package b

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

IC package with electrically conductive heat-radiating...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

IC package with integral substrate capacitor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

IC package with signal land pads

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

IC package, optical transmitter, and optical receiver

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

IC package, optical transmitter, and optical receiver

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

IC packages including separated signal and power supply edge con

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

IC packages with diamond substrate thermal conductor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

IC stack utilizing secondary leadframes

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

IC tag

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

ID chip and IC card

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

IGBT and free-wheeling diode combination

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

IGBT module construction

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Illumination device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Image forming apparatus with improved transfer efficiency

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means

Image sensing chip package structure