Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2006-05-23
2006-05-23
Williams, Alexander Oscar (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S717000, C257S712000, C257S713000, C257S720000, C257S675000, C257S684000, C257S796000, C257S696000, C257S691000, C257S698000, C257S690000, C257S784000, C257S786000, C257S701000, C361S783000, C361S720000, C361S071000, C361S719000, C174S252000
Reexamination Certificate
active
07049696
ABSTRACT:
A connection structure including an IC chip, a substrate disposed with a conductive layer, and a heat-radiating mechanism that is mounted on the substrate, disposed between the IC chip and the substrate, and dissipates heat of the IC chip, wherein terminals of the IC chip are electrically connected to the conductive layer via the heat-radiating mechanism.
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Fuji Photo Film Co. , Ltd.
Sughrue & Mion, PLLC
Williams Alexander Oscar
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