IC tag

Details IC tag IC tag

2007-11-13

2007-11-13

Purvis, Sue A. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Smart card package

C257SE23064, C340S572100, C340S572700

Reexamination Certificate

active

10535843

ABSTRACT:
The present invention provides an IC tag which has a structure comprising a first adhesive layer laminated on a surface of a substrate sheet, an electronic circuit containing a circuit line having a bypass line and an IC chip connecting to the electronic circuit which are formed on a surface of the first adhesive layer, a second adhesive layer laminated for covering the electronic circuit and the IC chip, and a release agent layer formed partly at the position corresponding to a circuit section consisting of the electronic circuit and the IC chip and located at the interface between the substrate sheet and the first adhesive layer, wherein the angle formed by the tangent of the bypass line at the connection between the bypass line and the circuit line and the tangent of the circuit line at the connection is 10 degree or greater. When the IC tag attached to an article is peeled off, the built-in electronic circuit is surely broken.

REFERENCES:
patent: 6421013 (2002-07-01), Chung
patent: 6888509 (2005-05-01), Atherton
patent: 2002/0036237 (2002-03-01), Atherton et al.
patent: 1 132 859 (2001-09-01), None
patent: 2000-105807 (2000-04-01), None
patent: 2001-13874 (2001-01-01), None
patent: 2001-109 866 (2001-04-01), None
patent: WO 02/082126 (2002-10-01), None

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