IC package with signal land pads

Details IC package with signal land pads IC package with signal land pads

2007-06-05

2007-06-05

Coleman, William David (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S780000, C438S106000, C438S107000

Reexamination Certificate

active

11060104

ABSTRACT:
In one embodiment, an integrated circuit package comprises a substrate including a first surface having a plurality of signal land pads and a second surface having a plurality of signal die pads; a plurality of signal connectors arranged to electrically couple the plurality of the signal land pads to the plurality of the signal die pads; and a ground plane, disposed in an adjacent, spaced-apart relationship to the plurality of signal land pads. The ground plane includes a plurality of holes with at least one of the holes having at least one of the signal connectors extending therethrough and being dimensioned and configured approximately to be as large or larger than at least one of the signal land pads disposed adjacent to the at least one hole.

REFERENCES:
patent: 6440770 (2002-08-01), Banerjee et al.
patent: 6483415 (2002-11-01), Tang
patent: 6584685 (2003-07-01), Chung et al.
patent: 2002/0180004 (2002-12-01), Oggioni et al.
patent: 2004/0166660 (2004-08-01), Yamaguchi
patent: 2004/0169198 (2004-09-01), Nagata et al.
patent: 2004332687 (2004-11-01), None
translated of JP2004332687 attached.

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