Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means
Reexamination Certificate
2007-10-16
2007-10-16
Cao, Phat X. (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With window means
C257S704000, C257SE31095
Reexamination Certificate
active
11225078
ABSTRACT:
In an image sensing chip package structure, plated through vias penetrate a substrate to electrically connect metallization traces disposed on the upper and lower surfaces of the substrate. The plated through vias can be opened from the center of the substrate instead of being located at the periphery of the substrate. Contamination can thus be avoided during the glue dispensing process, and protection layers can also be used to seal gaps generated by the plated through vias, hence enhancing the producing yield. Moreover, protection layers having stickiness can further be used to secure components so as to reduce the production cost and enhance the product quality.
REFERENCES:
patent: 6483030 (2002-11-01), Glenn et al.
patent: 6531784 (2003-03-01), Shim et al.
patent: 7005720 (2006-02-01), Huang et al.
Cao Phat X.
Rosenberg , Klein & Lee
Sigurd Microelectronics Corp.
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