LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

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Interposer containing bypass capacitors for reducing voltage...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Interposer for impedance matching

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Interposer for improved handling of semiconductor wafers and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Device held in place by clamping

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Interposer providing low-inductance decoupling capacitance...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Interposer stacking system and method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Interposer stacking system and method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Interposer with a lateral recess in a slot to facilitate...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Interposer with embedded circuitry and method for using the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Patent

[ 0.00 ] – not rated yet Voters 0 Comments 0

Interposer with flexible solder pad elements and methods of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Interposer with integral heat sink

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Interposer, semiconductor chip mounted sub-board, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Interposers and other carriers including a slot with...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Interposers for chip-scale packages and intermediates thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Interposers for chip-scale packages and intermediates thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Interposers with receptacles for receiving semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Intrinsic thermal enhancement for FBGA package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Inverted chip bonded module with high packaging efficiency

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Patent

[ 0.00 ] – not rated yet Voters 0 Comments 0

Inverted chip bonded with high packaging efficiency

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Patent

[ 0.00 ] – not rated yet Voters 0 Comments 0

Inverted CSP stacking system and method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Inverter module having a plurality of terminals at a...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

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