Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means
Reexamination Certificate
2007-09-25
2007-09-25
Thai, Luan (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With window means
C257S433000, C257S434000, C257SE23178, C257SE23188
Reexamination Certificate
active
10863447
ABSTRACT:
A semiconductor device package interposer including a receptacle extending substantially therethrough. Methods for assembling the interposer with one or more semiconductor devices are also disclosed. A film may be secured to a bottom surface of the interposer so as to at least partially cover a bottom end of the receptacle. One or more semiconductor devices are positioned within the receptacle, on the film. Each semiconductor device within the receptacle may then be electrically connected to the interposer. An encapsulant material, which is introduced into the receptacle, extends at least between portions of the outer periphery of each semiconductor device within the receptacle and a peripheral edge of the receptacle. Upon curing, setting, or hardening, the encapsulant material retains each semiconductor device within the receptacle and maintains a lateral position of each semiconductor device with respect to the interposer. Semiconductor device packages and multi-chip modules are also disclosed.
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Australian Search Report, dated Feb. 28, 2005 (3 pages).
Chye Lim Thiam
Eng Yap Kah
Fee Setho Sing
Guay Patrick
Heppler Steven W.
Micro)n Technology, Inc.
Thai Luan
TraskBritt
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