Interposer with integral heat sink

Details Interposer with integral heat sink Interposer with integral heat sink

2007-03-06

2007-03-06

Malsawma, Lex H. (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

Reexamination Certificate

active

10913743

ABSTRACT:
An area array connector for providing a thermal and an electrical interconnection between a first circuit element and a second circuit element is described. The area array connector includes at least one electrically conductive interconnector adapted to provide an electrical interconnection between the first circuit element and the second circuit element. The area array connector also includes at least one thermally conductive member adapted to provide thermal interconnection between the first circuit element and the second circuit element.

REFERENCES:
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U.S. Appl. No. 10/285,777, filed Nov. 1, 2002, Grant et al.
Polyplastics, “Molding Technology for Fortron”, Copyright 2001-2002, Polyplastics Co., Ltd., http://www.polyplastics.com/en/support/tech/pps—mold/index.html, (1 page).

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