Inverted chip bonded module with high packaging efficiency

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

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257690, 257698, 257703, H01L 2348, H01L 2304, H01L 23053, H01L 2306

Patent

active

056274068

ABSTRACT:
An electronic packaging module for inverted bonding of semiconductor devices, integrated circuits, and/or application specific integrated circuits is produced with protuberances on the conductive pattern of the substrate. The protuberances are of a soft, ductile metal capable of being metallurgically bonded to the input/output pads of semiconductor devices. The input/output pads of the semiconductor devices are simultaneously bonded to the protuberances of the packaging module.

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Balderes et al., "Heat Dissipation from IC Chips Through Module Package" IBM Technical Disclosure Bulletin v 19, No. 11, pp. 4165-4166 (Apr. 1977).

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