Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1996-08-12
1997-05-06
Jackson, Jr., Jerome
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257690, 257698, 257703, H01L 2348, H01L 2304, H01L 23053, H01L 2306
Patent
active
056274068
ABSTRACT:
An electronic packaging module for inverted bonding of semiconductor devices, integrated circuits, and/or application specific integrated circuits is produced with protuberances on the conductive pattern of the substrate. The protuberances are of a soft, ductile metal capable of being metallurgically bonded to the input/output pads of semiconductor devices. The input/output pads of the semiconductor devices are simultaneously bonded to the protuberances of the packaging module.
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Jackson, Jr. Jerome
Martin Wallace Valencia
McCormack John F.
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