LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Interconnection circuit and electronic module utilizing same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Interconnection for integrated high voltage electronic devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Interconnection of land section to wiring layers at center...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Interconnection substrate having metal columns covered by a...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Interconnections for a semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Interdigitated conductive lead frame or laminate lead frame...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With large area flexible electrodes in press contact with...

Interface module for connecting LSI packages, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Interleaved signal trace routing

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Interleaved signal trace routing

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Intermediate chip module, semiconductor device, circuit...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Intermediate substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Internal capacitor arrangement for semiconductor device assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Internal package heat dissipator

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Internal resistor termination in multi-chip module environments

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Interposer and method for producing the same and electronic...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Interposer and method of making same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Interposer and semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Interposer array module for capacitive decoupling and filtering

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Interposer configured to reduce the profiles of...