Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2005-09-27
2005-09-27
Williams, Alexander Oscar (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S717000, C257S713000, C257S720000, C257S786000, C257S666000, C257S673000, C257S696000, C257S737000, C257S738000, C257S787000, C257S675000, C257S668000, C257S698000
Reexamination Certificate
active
06949824
ABSTRACT:
A technique is provided for dissipating heat from an integrated circuit within a package. A thermally conductive strip may be installed between an integrated circuit and a substrate before packaging. The package is formed from molded epoxy formed around the integrated circuit and substrate with a portion of the thermally conductive strip extending beyond the confines of the package. Heat is conducted from the integrated circuit through the thermally conductive strip to the environment surrounding the package. A thermally conductive strip may be installed within a package by an adhesive or other mechanically means. A thermally conductive strip may be comprised of a metallic foil or other thermally conductive material.
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Fletcher Yoder
Micro)n Technology, Inc.
Williams Alexander Oscar
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