Internal resistor termination in multi-chip module environments

Details Internal resistor termination in multi-chip module environments Internal resistor termination in multi-chip module environments

1994-12-14

1997-06-03

Wojciechowicz, Edward

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257684, 257693, 257698, 257705, 257707, 257760, H01L 23053

Patent

active

056357613

ABSTRACT:
Thin-film conductor technology is utilized to form resistors of precisely controlled value within the interior of multi-chip modules to properly terminate network circuits which interconnect one or more chips with either output pin connections or other chips on the multi-chip module. By forming and disposing the resistors within the interior of the multi-chip module, the terminating resistors may be manufactured during the multi-chip module manufacturing process. This approach preserves valuable surface area available for interconnecting the computer chips to the multi-chip module rather than consuming scarce surface area with termination resistors and other circuit elements necessary to adapt the multi-chip module and the other computer chips to each other.

REFERENCES:
patent: 4811082 (1989-03-01), Jacobs et al.
patent: 5093587 (1992-03-01), Zbinden
patent: 5412539 (1995-05-01), Elwell et al.

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