Interposer and semiconductor device

Details Interposer and semiconductor device Interposer and semiconductor device

2011-04-12

2011-04-12

Landau, Matthew C (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S706000, C257S712000, C257S717000, C257S774000, C257SE23101, C257SE23102, C257SE23105

Reexamination Certificate

active

07923834

ABSTRACT:
An interposer and a semiconductor device including the interposer, which can prevent thermal warpage of an insulative substrate. The interposer is provided with a semiconductor chip in a semiconductor device and may be disposed between the semiconductor chip and a mount board. The interposer includes: a substrate of an insulative resin; an island on one surface of the substrate to be bonded to a rear surface of the chip; a thermal pad on the other surface opposite the one surface opposed to the island with the intervention of the substrate; and a thermal via extending through the substrate from the one surface to the other surface to thermally connect the island to the thermal pad.

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