Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2007-03-20
2007-03-20
Potter, Roy (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S777000
Reexamination Certificate
active
10947607
ABSTRACT:
An intermediate chip for electrically connecting semiconductor chips includes: a substrate having a first side and a second side; a trans-substrate conductive plug which projects to the first side of the substrate; a post electrode which is displaced from the trans-substrate conductive plug in plan view on the second side of the substrate; and wiring which is disposed in or on the substrate for coupling the trans-substrate conductive plug and the post electrode.
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Communication from Korean Patent Office re: related application.
Communication from Japanese Patent Office regarding corresponding application.
Communication from Chinese Patent Office re: related application.
Harness & Dickey & Pierce P.L.C.
Potter Roy
Seiko Epson Corporation
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