Intermediate substrate

Details Intermediate substrate Intermediate substrate

2005-12-27

2005-12-27

Nguyen, Tuyen T (Department: 2832)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C336S200000

Reexamination Certificate

active

06979890

ABSTRACT:
An intermediate substrate is provided which reduces the effect of the difference in the coefficients of linear expansion between the terminals of the substrate and those of a semiconductor integrated circuit device, and which thus lowers the likelihood of disconnection due to thermal stress. The intermediate substrate, which is a planar member made of a polymeric material, includes a substrate core including a main core body having formed therein a sub-core compartment, and a ceramic sub-core section accommodated in the compartment. A first terminal array on the first principal surface side includes two types of terminals, functioning either as power source terminals or ground terminals, and a signal terminal. The array occupies an area entirely included within an orthogonally projected region of the sub-core section projected onto a reference plane parallel to the planar surface of the substrate core.

REFERENCES:
patent: 5708296 (1998-01-01), Bhansali
patent: 5714801 (1998-02-01), Yano et al.
patent: 5898217 (1999-04-01), Johnston
patent: 6008534 (1999-12-01), Fulcher
patent: 6828666 (2004-12-01), Herrell et al.
patent: 1 041 631 (2000-10-01), None
patent: 2000-349225 (2000-12-01), None
patent: 2001-035966 (2001-02-01), None
patent: 2002-204071 (2002-07-01), None

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