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Folded flex circuit interconnect having a grid array interface

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Folded heat sink for semiconductor device package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Folded-flex bondwire-less multichip power package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Reexamination Certificate

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Folding chip planar stack package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Folding chip planar stack package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Formation of a hybrid integrated circuit device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Formation of metal oxide gate dielectric

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Forming a multi segment integrated circuit with isolated...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Forming a semiconductor package including a thermal...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Forming a substantially planar upper surface at the outer...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Framed chip hybrid stacked layer assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Patent

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Framed sheets

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Freeform substrates and devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Reexamination Certificate

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Front edge chamfer feature for fully-molded memory cards

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Reexamination Certificate

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Functional device-mounted module and a process for producing...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Functional lid for RF power package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device
Reexamination Certificate

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Functional substrates for packaging semiconductor chips

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Functionally gradient integrated metal-ceramic member and semico

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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