Folded flex circuit interconnect having a grid array interface
Folded heat sink for semiconductor device package
Folded-flex bondwire-less multichip power package
Folding chip planar stack package
Folding chip planar stack package
Formation of a hybrid integrated circuit device
Formation of metal oxide gate dielectric
Forming a multi segment integrated circuit with isolated...
Forming a semiconductor package including a thermal...
Forming a substantially planar upper surface at the outer...
Framed chip hybrid stacked layer assembly
Framed sheets
Freeform substrates and devices
Front edge chamfer feature for fully-molded memory cards
Functional device-mounted module and a process for producing...
Functional lid for RF power package
Functional substrates for packaging semiconductor chips
Functionally gradient integrated metal-ceramic member and semico