Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2000-02-28
2001-07-17
Williams, Alexander O. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S713000, C257S707000, C257S680000, C257S675000, C257S703000, C257S705000, C257S700000, C257S706000
Reexamination Certificate
active
06262481
ABSTRACT:
BACKGROUND OF THE INVENTION
(1) Field of the Invention
This invention relates to semiconductor device package, in particular to the heat sink of the package.
(2) Description of the Related Art
As semiconductor technology progresses, the semiconductor chip becomes smaller and smaller, the integrated circuit becomes denser and denser, and the chip generates more and more heat.
FIG. 1
shows the top view of a prior art package.
FIG. 2
shows the side view of
FIG. 1. A
semiconductor chip
10
is mounted on a heat conducting metal layer
12
over a substrate
14
. The heat conducting metal
12
conducts away the heat generated from the chip
10
.
Such a conventional packaging technique is inadequate to accommodate the high heat dissipation of modern high density integrated circuit. A low thermal impedance is needed to prevent the chip to reach an excessive temperature.
Take a light emitting semiconductor chip for instance. The high brightness requirement of the chip dictates that the chip generates a great deal of heat. This heat must be removed to prevent any damage to the chip. Therefore, the ability to remove the heat is directly related to the brightness which the chip can attain. Therefore, the thermal impedance is directly related to the ability to achieve brightness. Such is the goal pursued by the semiconductor industry.
SUMMARY OF THE INVENTION
The object of this invention is to provide a semiconductor device package with low thermal impedance in preventing a high operating temperature of the semiconductor device. Another object of the invention is to provide heat sink without increasing the volume of the package. Still another object of the invention is to achieve high brightness of a light emitting device.
These objects are achieved by adding cooling fins within the confines of the package. The fins wrap around the substrate upon which a semiconductor chip is mounted. The fins can wrap around a hole in the middle of the substrate, or the edges of the substrate. A heat conducting metal plate can be placed between the chip and the fins to hold the chip when the chip is smaller than the through-hole.
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Harvatek Corporation
Lin Patent Agent H. C.
Williams Alexander O.
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