Framed chip hybrid stacked layer assembly

Details Framed chip hybrid stacked layer assembly Framed chip hybrid stacked layer assembly

1992-07-10

1993-07-27

LaRoche, Eugene R.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With semiconductor element forming part

257686, 257692, 257723, H01L 2702, H05K 720

Patent

active

052313042

ABSTRACT:
A stacked integrated circuit assembly [and method of fabricating the same are disclosed. The assembly] includes a plurality of insulating substrate layers each supporting one or more embedded integrated circuit chips. The substrates each incorporate substantially identical conductive patterns formed on the insulating layer surface and/or on an insulating film that covers the substrate.

REFERENCES:
patent: 3400210 (1968-09-01), Retmer
patent: 3436604 (1969-04-01), Hyltin et al.
patent: 3471754 (1969-10-01), Moshi et al.
patent: 3947957 (1976-04-01), Luttmer
patent: 4304624 (1981-12-01), Carson et al.
patent: 4320438 (1982-03-01), Ibrahim et al.
patent: 4352715 (1982-10-01), Carson et al.
patent: 4354107 (1982-10-01), Carson et al.
patent: 4361717 (1982-11-01), Gilmore et al.
patent: 4371744 (1983-02-01), Badet et al.
patent: 4403238 (1983-09-01), Clark
patent: 4423468 (1983-12-01), Gatto et al.
patent: 4525921 (1985-07-01), Carson et al.
patent: 4551629 (1985-11-01), Carson et al.
patent: 4572757 (1986-02-01), Spadafora
patent: 4604678 (1986-08-01), Hagner
patent: 4618763 (1986-12-01), Schmitz
patent: 4659931 (1987-04-01), Schmitz et al.
patent: 4660066 (1987-04-01), Reid
patent: 4670770 (1987-06-01), Tai
patent: 4703170 (1987-10-01), Schmitz
patent: 4721995 (1988-01-01), Tanizawa
patent: 4761681 (1988-08-01), Reid
patent: 4792672 (1988-12-01), Schmitz
patent: 4794092 (1988-12-01), Solomon
patent: 4797715 (1989-01-01), Thillays et al.
patent: 4903114 (1990-02-01), Aoki et al.
patent: 4989063 (1991-01-01), Kolesar, Jr.
patent: 4999740 (1991-03-01), Ilardi et al.
patent: 5018051 (1991-05-01), Yamada et al.
patent: 5032896 (1991-07-01), Little et al.

Affiliated with

Also associated with

Rating

Framed chip hybrid stacked layer assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Framed chip hybrid stacked layer assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Framed chip hybrid stacked layer assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2344086