Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2005-04-12
2005-04-12
Flynn, Nathan J. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S700000, C257S703000
Reexamination Certificate
active
06879032
ABSTRACT:
A folded flex circuit interconnect increases a number of interconnection pads of a grid array interface available to accommodate high count outputs from distinct circuit elements. The circuit interconnect includes a substrate capable of being folded, a conductor layer adjacent to a surface of the substrate, and a pad array having an interconnection pad connected to the conductor layer at a first end of the circuit interconnect. The pad array is part of the grid array interface. An optics module includes the folded flex circuit interconnect and an optical unit. The folded flex circuit interconnect further includes an electrical interface at a second end that is connected to the conductor layer. The folded flex circuit interconnect connects to the optical unit using the electrical interface. The circuit interconnect connects the optical unit to a motherboard using the pad array at the first end.
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Jeff Strole et al., “A Novel Flex Circuit Area-Array Interconnect System for a Catheter-Based Ultrasound Transducer”, IMAPS 2002, Denver, CO, Sep. 5, 2001.
Ali Mohammed E.
Lemoff Brian E.
Rosenau Steven A.
Windover Lisa A.
Andújar Leonardo
Flynn Nathan J.
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