Folded flex circuit interconnect having a grid array interface

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

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C257S700000, C257S703000

Reexamination Certificate

active

06879032

ABSTRACT:
A folded flex circuit interconnect increases a number of interconnection pads of a grid array interface available to accommodate high count outputs from distinct circuit elements. The circuit interconnect includes a substrate capable of being folded, a conductor layer adjacent to a surface of the substrate, and a pad array having an interconnection pad connected to the conductor layer at a first end of the circuit interconnect. The pad array is part of the grid array interface. An optics module includes the folded flex circuit interconnect and an optical unit. The folded flex circuit interconnect further includes an electrical interface at a second end that is connected to the conductor layer. The folded flex circuit interconnect connects to the optical unit using the electrical interface. The circuit interconnect connects the optical unit to a motherboard using the pad array at the first end.

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Kirk Giboney et al., “Next Generation Parallel-Optical Data Links”, IEEE Lasers and Electro-Optics Society 2001 Annual Meeting, San Diego, CA, Nov. 12-15, 2001.
Jeff Strole et al., “A Novel Flex Circuit Area-Array Interconnect System for a Catheter-Based Ultrasound Transducer”, IMAPS 2002, Denver, CO, Sep. 5, 2001.

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