Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2007-03-13
2010-12-21
Nguyen, Cuong Q (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C257S431000, C257S432000, C257S434000, C257SE23133, C257SE31131, C438S064000
Reexamination Certificate
active
07855440
ABSTRACT:
An optical functional device-mounted module and a producing process thereof. A bank to dam a liquid sealing resin is provided on a substrate around an optical functional device, the substrate being formed with a predetermined wiring pattern and having the optical functional device mounted thereon. The liquid sealing resin is filled between the functional device and the bank by dropping the liquid sealing resin therebetween. A package component member having a light transmission hole corresponding to an optical function part of the optical functional device is brought into contact with the bank such that the light transmission hole is opposed to the function part of the optical functional device, thereby causing the package component member to contact with the liquid sealing resin. The package component member is fixed onto the substrate by curing the liquid sealing resin and the bank is finally cut off and removed.
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Taiwan Notice of Rejection for Application No. 094129064; mailed Oct. 6, 2009 (with translation).
Asada Takahiro
Yoneda Yoshihiro
Lam Cathy N
Nguyen Cuong Q
Oliff & Berridg,e PLC
Sony Chemical and Information Device Corporation
Sony Corporation
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