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Selected: D

Die attachment and method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With housing mount
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Die carrier with fluid chamber

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
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Die clip assembly for semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Die package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Die package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
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Die paddle for receiving an integrated circuit die in a...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Die stacking scheme

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Die stacking scheme

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Die stacking scheme

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Die support structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Die support structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Die to die connection method and assemblies and packages...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Die-down ball grid array package with die-attached heat...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Die-up ball grid array package including a substrate capable...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
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Die-up ball grid array package with a heat spreader and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
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Die-up ball grid array package with attached stiffener ring

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
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Die-up ball grid array package with die-attached heat spreader

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Die-up ball grid array package with enhanced stiffener

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Die-up ball grid array package with patterned stiffener opening

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Die-up ball grid array package with printed circuit board...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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