Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2005-04-19
2005-04-19
Prenty, Mark V. (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S692000
Reexamination Certificate
active
06882037
ABSTRACT:
A die paddle for receiving an integrated circuit die in a plastic substrate. The die paddle is defined by a copper film on the plastic substrate and comprises a plurality of via holes through the plastic substrate, a plurality of opening through the copper film, and a gold-containing ring formed on the peripheral portion of the copper film. The outermost openings (and/or the outermost via holes) and the gold-containing ring are separated by a distance of about 1 to about 20 mils.
REFERENCES:
patent: 20040027814 (2004-02-01), Lin et al.
Lin Wei-Feng
Liu Wei-Chi
Wu Chung-Ju
Prenty Mark V.
Silicon Integrated Systems Corp.
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