Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2005-02-08
2005-02-08
Flynn, Nathan (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S717000, C257S737000, C438S122000
Reexamination Certificate
active
06853070
ABSTRACT:
An apparatus, system, and method for assembling a ball grid array (BGA) package is described. A stiffener/heat spreader is provided. A substrate has a first surface and a second surface. The substrate has a central window-shaped aperture that extends through the substrate from the first substrate surface to the second substrate surface. The first substrate surface is attached to a surface of the stiffener/heat spreader. A portion of the stiffener/heat spreader is accessible through the central window-shaped aperture. An IC die has a first surface and a second surface. The first IC die surface is mounted to the accessible portion of the stiffener/heat spreader. A drop-in heat spreader has a surface that is mounted to the second IC die surface.
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Cole, M.S. and Caulfield, T. &#
Khan Reza-ur Rahman
Zhao Sam Ziqun
Andújar Leonardo
Broadcom Corporation
Flynn Nathan
Sterne Kessler Goldstein & Fox P.L.L.C.
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