Die package structure

Details Die package structure Die package structure

2007-07-31

2007-07-31

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S777000

Reexamination Certificate

active

11514827

ABSTRACT:
The present invention relates to a die package structure. The package structure comprises a first substrate, a first die, a sub-package and a first molding compound. The first die is disposed on the first substrate. The sub-package comprises a second substrate, a second die and a second molding compound. The second die is disposed on the second substrate. The second molding compound encapsulates the second die. The second molding compound has at least one protrusion, and the protrusion contacts with the first die. The first molding compound encapsulates the first die and the sub-package. Whereby, by utilizing the second molding compound that has the protrusion to replace the spacer in the stacked package, the packaging process can be shortened, and the components of the package can be reduced.

REFERENCES:
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patent: 6114221 (2000-09-01), Tonti et al.
patent: 6339255 (2002-01-01), Shin
patent: 6518659 (2003-02-01), Glenn
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patent: 6670720 (2003-12-01), King et al.
patent: 6753205 (2004-06-01), Halahan
patent: 6753599 (2004-06-01), Kim
patent: 6781243 (2004-08-01), Li et al.
patent: 7109576 (2006-09-01), Bolken et al.

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