Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2006-09-26
2006-09-26
Andujar, Leonardo (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
27, 27
Reexamination Certificate
active
07112878
ABSTRACT:
An improved die stacking scheme is provided. In accordance with one embodiment of the present invention, a multiple die semiconductor assembly is provided comprising a substrate, first and second semiconductor dies, and at least one decoupling capacitor. The first semiconductor die defines a first active surface. The first active surface includes at least one conductive bond pad. The second semiconductor die defines a second active surface, the second active surface includes at least one conductive bond pad. The first semiconductor die is interposed between the substrate and the second semiconductor die such that a surface of the second semiconductor die defines an uppermost die surface of the multiple die semiconductor assembly and such that a surface of the first semiconductor die defines a lowermost die surface of the multiple die semiconductor assembly. The decoupling capacitor is secured to the uppermost die surface and is conductively coupled to at least one of the first and second semiconductor dies.
REFERENCES:
patent: 4996587 (1991-02-01), Hinrichsmeyer et al.
patent: 5095402 (1992-03-01), Hernandez et al.
patent: 5107328 (1992-04-01), Kinsman
patent: 5212402 (1993-05-01), Higgins, III
patent: 5247423 (1993-09-01), Lin
patent: 5254871 (1993-10-01), Benavides et al.
patent: 5283717 (1994-02-01), Hundt
patent: 5334875 (1994-08-01), Sugano et al.
patent: 5355016 (1994-10-01), Swirbel et al.
patent: 5379189 (1995-01-01), Merriman
patent: 5418752 (1995-05-01), Harari et al.
patent: 5444296 (1995-08-01), Kaul et al.
patent: 5463253 (1995-10-01), Waki et al.
patent: 5532910 (1996-07-01), Suzuki et al.
patent: 5646828 (1997-07-01), Degani et al.
patent: 5652463 (1997-07-01), Weber et al.
patent: 5656856 (1997-08-01), Kweon
patent: 5674785 (1997-10-01), Akram et al.
patent: 5677566 (1997-10-01), King et al.
patent: 5684677 (1997-11-01), Uchida et al.
patent: 5701033 (1997-12-01), Ueda et al.
patent: 5808878 (1998-09-01), Saito et al.
patent: 5811879 (1998-09-01), Akram
patent: 5838546 (1998-11-01), Miyoshi
patent: 5898224 (1999-04-01), Akram
patent: 5923090 (1999-07-01), Fallon et al.
patent: 5952611 (1999-09-01), Eng et al.
patent: 5969426 (1999-10-01), Baba
patent: 5973403 (1999-10-01), Wark
patent: 5982038 (1999-11-01), Toy et al.
patent: 5994166 (1999-11-01), Akram et al.
patent: 5994773 (1999-11-01), Hirakawa
patent: 6005778 (1999-12-01), Spielberger et al.
patent: 6013877 (2000-01-01), Degani et al.
patent: 6013948 (2000-01-01), Akram et al.
patent: 6020629 (2000-02-01), Farnworth et al.
patent: 6051878 (2000-04-01), Akram et al.
patent: 6069025 (2000-05-01), Kim
patent: 6081023 (2000-06-01), Murakami et al.
patent: 6087717 (2000-07-01), Ano et al.
patent: 6093957 (2000-07-01), Kwon
patent: 6093969 (2000-07-01), Lin
patent: 6118176 (2000-09-01), Tao et al.
patent: 6157080 (2000-12-01), Tamaki et al.
patent: 6181002 (2001-01-01), Juso et al.
patent: 6222246 (2001-04-01), Mak et al.
patent: 6236109 (2001-05-01), Hsuan et al.
patent: 6262488 (2001-07-01), Masayuki et al.
patent: 6265771 (2001-07-01), Ference et al.
patent: 6300163 (2001-10-01), Akram
patent: 6303981 (2001-10-01), Moden
patent: 6316727 (2001-11-01), Liu
patent: 6335566 (2002-01-01), Hirashima et al.
patent: 6337510 (2002-01-01), Chun-Jen et al.
patent: 6344682 (2002-02-01), Tomita
patent: 6388336 (2002-05-01), Venkateshwaran et al.
patent: 6407456 (2002-06-01), Ball
patent: 6462412 (2002-10-01), Kamei et al.
patent: 6507098 (2003-01-01), Lo et al.
patent: 6646334 (2003-11-01), Hur
patent: 6707141 (2004-03-01), Akram
patent: 2001/0015485 (2001-08-01), Song et al.
patent: 2002/0074668 (2002-06-01), Hofstee et al.
patent: 2002/0074669 (2002-06-01), Watanabe et al.
patent: 2002/0079567 (2002-06-01), Lo et al.
patent: 2002/0079573 (2002-06-01), Akram
patent: 59-48949 (1984-03-01), None
patent: 359111350 (1984-06-01), None
patent: 61-147559 (1986-07-01), None
patent: 02-158147 (1990-06-01), None
patent: 403096266 (1991-04-01), None
patent: 403187253 (1991-08-01), None
patent: 04-155857 (1992-05-01), None
patent: 5-343603 (1993-12-01), None
patent: 2001102512 (2001-04-01), None
patent: 2001-577215 (2001-05-01), None
patent: 02001308140 (2001-11-01), None
patent: WO 97/37374 (1997-10-01), None
“Multi-Chip Module on Laminate, High-performance packaging for today's silicon,” IBM Microelectronics, 1998.
Andujar Leonardo
Dinsmore & Shohl LLP
LandOfFree
Die stacking scheme does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Die stacking scheme, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Die stacking scheme will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3588085