Die-up ball grid array package including a substrate capable...

Details Die-up ball grid array package including a substrate capable... Die-up ball grid array package including a substrate capable...

2007-08-21

2007-08-21

Lewis, Monica (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S712000, C257S706000, C257S779000, C257S780000

Reexamination Certificate

active

10939075

ABSTRACT:
An electrically and thermally enhanced die-up tape substrate ball grid array (BGA) package and die-up plastic substrate BGA package are described. A substrate that has a first surface and a second surface is received. A heat spreader has a first surface and a second surface. The first heat spreader surface is attached to the second substrate surface. A plurality of solder balls are attached to the second substrate surface outside an outer dimensional profile of the heat spreader. The second heat spreader surface is configured to be coupled to a printed circuit board (PCB).

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Amkor Electronics, “Amko

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