Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2002-07-23
2010-12-28
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S713000, C257S784000, C257SE23101
Reexamination Certificate
active
07859101
ABSTRACT:
An electrically and thermally enhanced die-up tape substrate ball grid array (BGA) package and die-up plastic substrate BGA package are described. A substrate that has a first surface and a second surface is provided. The stiffener has a first surface and a second surface. The second stiffener surface is attached to the first substrate surface. An IC die has a first surface and a second surface. The first IC die surface is mounted to the first stiffener surface. A plurality of solder balls is attached to the second substrate surface. In one aspect, a heat spreader is mounted to the second IC die surface. In another aspect, the stiffener is coupled to ground to act as a ground plane. In another aspect, the substrate has a window opening that exposes a portion of the second stiffener surface. The exposed portion of the second stiffener surface is configured to be coupled to a printed circuit board (PCB). In another aspect, a metal ring is attached to the first stiffener surface. In another aspect, wire bond openings in the stiffener are bridged by one or more studs.
REFERENCES:
patent: 3790866 (1974-02-01), Meyer et al.
patent: 4611238 (1986-09-01), Lewis et al.
patent: 5045921 (1991-09-01), Lin et al.
patent: 5065281 (1991-11-01), Hernandez et al.
patent: 5173766 (1992-12-01), Long et al.
patent: 5208504 (1993-05-01), Parker et al.
patent: 5216278 (1993-06-01), Lin et al.
patent: 5285352 (1994-02-01), Pastore et al.
patent: 5291062 (1994-03-01), Higgins et al.
patent: 5294826 (1994-03-01), Marcantonio et al.
patent: 5366589 (1994-11-01), Chang
patent: 5394009 (1995-02-01), Loo
patent: 5397917 (1995-03-01), Ommen et al.
patent: 5397921 (1995-03-01), Karnezos
patent: 5409865 (1995-04-01), Karnezos
patent: 5433631 (1995-07-01), Beaman et al.
patent: 5438216 (1995-08-01), Juskey et al.
patent: 5474957 (1995-12-01), Urushima
patent: 5490324 (1996-02-01), Newman
patent: 5534467 (1996-07-01), Rostoker
patent: 5541450 (1996-07-01), Jones et al.
patent: 5552635 (1996-09-01), Kim et al.
patent: 5572405 (1996-11-01), Wilson et al.
patent: 5578869 (1996-11-01), Hoffman et al.
patent: 5583377 (1996-12-01), Higgins, III
patent: 5583378 (1996-12-01), Marrs et al.
patent: 5642261 (1997-06-01), Bond et al.
patent: 5648679 (1997-07-01), Chillara et al.
patent: 5650659 (1997-07-01), Mostafazadeh et al.
patent: 5650662 (1997-07-01), Edwards et al.
patent: 5691567 (1997-11-01), Lo et al.
patent: 5717252 (1998-02-01), Nakashima et al.
patent: 5736785 (1998-04-01), Chiang et al.
patent: 5744863 (1998-04-01), Culnane et al.
patent: 5796170 (1998-08-01), Marcantonio
patent: 5798909 (1998-08-01), Bhatt et al.
patent: 5801432 (1998-09-01), Rostoker et al.
patent: 5835355 (1998-11-01), Dordi
patent: 5843808 (1998-12-01), Karnezos
patent: 5844168 (1998-12-01), Schueller et al.
patent: 5856911 (1999-01-01), Riley
patent: 5866949 (1999-02-01), Schueller
patent: 5883430 (1999-03-01), Johnson
patent: 5889321 (1999-03-01), Culnane et al.
patent: 5889324 (1999-03-01), Suzuki
patent: 5894410 (1999-04-01), Barrow
patent: 5895967 (1999-04-01), Stearns et al.
patent: 5901041 (1999-05-01), Davies et al.
patent: 5903052 (1999-05-01), Chen et al.
patent: 5905633 (1999-05-01), Shim et al.
patent: 5907189 (1999-05-01), Mertol
patent: 5907903 (1999-06-01), Ameen et al.
patent: 5920117 (1999-07-01), Sono et al.
patent: 5949137 (1999-09-01), Domadia et al.
patent: 5953589 (1999-09-01), Shim et al.
patent: 5972734 (1999-10-01), Carichner et al.
patent: 5976912 (1999-11-01), Fukutomi et al.
patent: 5977626 (1999-11-01), Wang et al.
patent: 5977633 (1999-11-01), Suzuki et al.
patent: 5982621 (1999-11-01), Li
patent: 5986340 (1999-11-01), Mostafazadeh et al.
patent: 5986885 (1999-11-01), Wyland
patent: 5998241 (1999-12-01), Niwa
patent: 5999415 (1999-12-01), Hamzehdoost
patent: 6002147 (1999-12-01), Iovdalsky et al.
patent: 6002169 (1999-12-01), Chia et al.
patent: 6011304 (2000-01-01), Mertol
patent: 6011694 (2000-01-01), Hirakawa
patent: 6020637 (2000-02-01), Karnezos
patent: 6028358 (2000-02-01), Suzuki
patent: 6034427 (2000-03-01), Lan et al.
patent: 6040984 (2000-03-01), Hirakawa
patent: 6057601 (2000-05-01), Lau et al.
patent: 6060777 (2000-05-01), Jamieson et al.
patent: 6069407 (2000-05-01), Hamzehdoost
patent: 6077724 (2000-06-01), Chen
patent: 6084297 (2000-07-01), Brooks et al.
patent: 6084777 (2000-07-01), Kalidas et al.
patent: 6114761 (2000-09-01), Mertol et al.
patent: 6117797 (2000-09-01), Hembree
patent: 6122171 (2000-09-01), Akram et al.
patent: 6133064 (2000-10-01), Nagarajan et al.
patent: 6140707 (2000-10-01), Plepys et al.
patent: 6160705 (2000-12-01), Stearns et al.
patent: 6162659 (2000-12-01), Wu
patent: 6163458 (2000-12-01), Li
patent: 6166434 (2000-12-01), Desai et al.
patent: 6184580 (2001-02-01), Lin
patent: 6201300 (2001-03-01), Tseng et al.
patent: 6207467 (2001-03-01), Vaiyapuri et al.
patent: 6212070 (2001-04-01), Atwood et al.
patent: 6242279 (2001-06-01), Ho et al.
patent: 6246111 (2001-06-01), Huang et al.
patent: 6278613 (2001-08-01), Fernandez et al.
patent: 6288444 (2001-09-01), Abe et al.
patent: 6313521 (2001-11-01), Baba
patent: 6313525 (2001-11-01), Sasano
patent: 6347037 (2002-02-01), Iijima et al.
patent: 6362525 (2002-03-01), Rahim
patent: 6369455 (2002-04-01), Ho et al.
patent: 6380623 (2002-04-01), Demore
patent: 6462274 (2002-10-01), Shim et al.
patent: 6472741 (2002-10-01), Chen et al.
patent: 6525942 (2003-02-01), Huang et al.
patent: 6528869 (2003-03-01), Glenn et al.
patent: 6528892 (2003-03-01), Caletka et al.
patent: 6541832 (2003-04-01), Coyle
patent: 6545351 (2003-04-01), Jamieson et al.
patent: 6552266 (2003-04-01), Carden et al.
patent: 6552428 (2003-04-01), Huang et al.
patent: 6552430 (2003-04-01), Perez et al.
patent: 6563712 (2003-05-01), Akram et al.
patent: 6583516 (2003-06-01), Hashimoto
patent: 6614660 (2003-09-01), Bai et al.
patent: 6617193 (2003-09-01), Toshio et al.
patent: 6657870 (2003-12-01), Ali et al.
patent: 6664617 (2003-12-01), Siu
patent: 6724071 (2004-04-01), Combs
patent: 6724080 (2004-04-01), Ooi et al.
patent: 2001/0001505 (2001-05-01), Schueller et al.
patent: 2001/0040279 (2001-11-01), Mess et al.
patent: 2001/0045644 (2001-11-01), Huang
patent: 2002/0053731 (2002-05-01), Chao et al.
patent: 2002/0072214 (2002-06-01), Yuzawa et al.
patent: 2002/0096767 (2002-07-01), Cote et al.
patent: 2002/0098617 (2002-07-01), Lee et al.
patent: 2002/0171144 (2002-11-01), Zhang et al.
patent: 2002/0180040 (2002-12-01), Camenforte et al.
patent: 2002/0185717 (2002-12-01), Eghan et al.
patent: 2003/0138613 (2003-07-01), Thoman et al.
patent: 2004/0072456 (2004-04-01), Dozier, II et al.
patent: 0 573 297 (1993-12-01), None
patent: 0 504 411 (1998-06-01), None
patent: 2 803 098 (2001-06-01), None
patent: 61-49446 (1986-03-01), None
patent: 7-283336 (1995-10-01), None
patent: 10-50877 (1998-02-01), None
patent: 10-189835 (1998-07-01), None
patent: 10-247702 (1998-09-01), None
patent: 10-247703 (1998-09-01), None
patent: 11-17064 (1999-01-01), None
patent: 11-102989 (1999-04-01), None
patent: 11102989 (1999-04-01), None
patent: 2000-286294 (2000-10-01), None
patent: 2001-68512 (2001-03-01), None
patent: 383908 (2000-03-01), None
patent: 417219 (2001-01-01), None
Ahn, S.H. and Kwon, Y.S., “Popcorn Phenomena in a Ball Grid Array Package”, IEEE Transactions on Components, Packaging, and Manufacturing Technology Part B: Advanced Packaging, IEEE, Aug. 1995, vol. 18, No. 3, pp. 491-496.
Amkor Electronics, “Amkor BGA Packaging: Taking The World by Storm”, Electronic Packaging & Production, Cahners Publishing Company, May 1994, page unknown.
Anderson, L. and Trabucco, B., “Solder Attachment Analysis of Plastic BGA Modules”, Surface Mount International Conference, Surface Mount International, Aug. 28-Sep. 1, 1994, San Jose, California, pp. 189-194.
Andrews, M., “Trends in Ball Grid Array Technology,” Ball Grid Array National Symposium, Mar. 29-30, 1995, Dallas, Texas, 10 pages.
Attarwala, A.I. Dr. And Stierman, R., “Failure Mode Analysis of a 540 Pin Plastic Ball Grid Array”, Surface Mount Internat
Khan Reza-ur R
Zhao Sam Z
Broadcom Corporation
Parekh Nitin
Sterne Kessler Goldstein & Fox PLLC
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