Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2007-08-21
2007-08-21
Lewis, Monica (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C257S706000, C257S720000, C257S779000, C257S780000, C257S712000, C257S713000, C257S778000
Reexamination Certificate
active
09849537
ABSTRACT:
An electrically and thermally enhanced die-up tape substrate ball grid array (BGA) package and die-up plastic substrate BGA package are described. A substrate that has a first surface and a second surface is received. A heat spreader has a first surface and a second surface. The first heat spreader surface is attached to the second substrate surface. A plurality of solder balls are attached to the second substrate surface outside an outer dimensional profile of the heat spreader. The second heat spreader surface is configured to be coupled to a printed circuit board (PCB).
REFERENCES:
patent: 3790866 (1974-02-01), Meyer et al.
patent: 4611238 (1986-09-01), Lewis et al.
patent: 5045921 (1991-09-01), Lin et al.
patent: 5065281 (1991-11-01), Hernandez et al.
patent: 5173766 (1992-12-01), Long et al.
patent: 5208504 (1993-05-01), Parker et al.
patent: 5216278 (1993-06-01), Lin et al.
patent: 5285352 (1994-02-01), Pastore et al.
patent: 5291062 (1994-03-01), Higgins, III
patent: 5294826 (1994-03-01), Marcantonio et al.
patent: 5366589 (1994-11-01), Chang
patent: 5394009 (1995-02-01), Loo
patent: 5397917 (1995-03-01), Ommen et al.
patent: 5397921 (1995-03-01), Karnezos
patent: 5409865 (1995-04-01), Karnezos
patent: 5433631 (1995-07-01), Beaman et al.
patent: 5438216 (1995-08-01), Juskey et al.
patent: 5474957 (1995-12-01), Urushima
patent: 5490324 (1996-02-01), Newman
patent: 5534467 (1996-07-01), Rostoker
patent: 5541450 (1996-07-01), Jones et al.
patent: 5552635 (1996-09-01), Kim et al.
patent: 5572405 (1996-11-01), Wilson et al.
patent: 5578869 (1996-11-01), Hoffman et al.
patent: 5583377 (1996-12-01), Higgins, III
patent: 5583378 (1996-12-01), Marrs et al.
patent: 5642261 (1997-06-01), Bond et al.
patent: 5648679 (1997-07-01), Chillara et al.
patent: 5650659 (1997-07-01), Mostafazadeh et al.
patent: 5650662 (1997-07-01), Edwards et al.
patent: 5691567 (1997-11-01), Lo et al.
patent: 5717252 (1998-02-01), Nakashima et al.
patent: 5736785 (1998-04-01), Chiang et al.
patent: 5744863 (1998-04-01), Culnane et al.
patent: 5796170 (1998-08-01), Marcantonio
patent: 5798909 (1998-08-01), Bhatt et al.
patent: 5801432 (1998-09-01), Rostoker et al.
patent: 5835355 (1998-11-01), Dordi
patent: 5843808 (1998-12-01), Karnezos
patent: 5844168 (1998-12-01), Schueller et al.
patent: 5856911 (1999-01-01), Riley
patent: 5866949 (1999-02-01), Schueller
patent: 5883430 (1999-03-01), Johnson
patent: 5889321 (1999-03-01), Culnane et al.
patent: 5889324 (1999-03-01), Suzuki
patent: 5894410 (1999-04-01), Barrow
patent: 5895967 (1999-04-01), Stearns et al.
patent: 5901041 (1999-05-01), Davies et al.
patent: 5903052 (1999-05-01), Chen et al.
patent: 5905633 (1999-05-01), Shim et al.
patent: 5907189 (1999-05-01), Mertol
patent: 5907903 (1999-06-01), Ameen et al.
patent: 5920117 (1999-07-01), Sono et al.
patent: 5949137 (1999-09-01), Domadia et al.
patent: 5953589 (1999-09-01), Shim et al.
patent: 5972734 (1999-10-01), Carichner et al.
patent: 5976912 (1999-11-01), Fukutomi et al.
patent: 5977626 (1999-11-01), Wang et al.
patent: 5977633 (1999-11-01), Suzuki et al.
patent: 5982621 (1999-11-01), Li
patent: 5986340 (1999-11-01), Mostafazadeh et al.
patent: 5986885 (1999-11-01), Wyland
patent: 5998241 (1999-12-01), Niwa
patent: 5999415 (1999-12-01), Hamzehdoost
patent: 6002147 (1999-12-01), Iovdalsky et al.
patent: 6002169 (1999-12-01), Chia et al.
patent: 6011304 (2000-01-01), Mertol
patent: 6011694 (2000-01-01), Hirakawa
patent: 6020637 (2000-02-01), Karnezos
patent: 6028358 (2000-02-01), Suzuki
patent: 6034427 (2000-03-01), Lan et al.
patent: 6040984 (2000-03-01), Hirakawa
patent: 6046077 (2000-04-01), Baba
patent: 6057601 (2000-05-01), Lau et al.
patent: 6060777 (2000-05-01), Jamieson et al.
patent: 6069407 (2000-05-01), Hamzehdoost
patent: 6077724 (2000-06-01), Chen
patent: 6084297 (2000-07-01), Brooks et al.
patent: 6084777 (2000-07-01), Kalidas et al.
patent: 6114761 (2000-09-01), Mertol et al.
patent: 6117797 (2000-09-01), Hembree
patent: 6122171 (2000-09-01), Akram et al.
patent: 6133064 (2000-10-01), Nagarajan et al.
patent: 6140707 (2000-10-01), Plepys et al.
patent: 6160705 (2000-12-01), Stearns et al.
patent: 6162659 (2000-12-01), Wu
patent: 6163458 (2000-12-01), Li
patent: 6166434 (2000-12-01), Desai et al.
patent: 6184580 (2001-02-01), Lin
patent: 6201300 (2001-03-01), Tseng et al.
patent: 6207467 (2001-03-01), Vaiyapuri et al.
patent: 6212070 (2001-04-01), Atwood et al.
patent: 6242279 (2001-06-01), Ho et al.
patent: 6246111 (2001-06-01), Huang et al.
patent: 6278613 (2001-08-01), Fernandez et al.
patent: 6288444 (2001-09-01), Abe et al.
patent: 6313521 (2001-11-01), Baba
patent: 6313525 (2001-11-01), Sasano
patent: 6347037 (2002-02-01), Iijima et al.
patent: 6362525 (2002-03-01), Rahim
patent: 6369455 (2002-04-01), Ho et al.
patent: 6380623 (2002-04-01), Demore
patent: 6462274 (2002-10-01), Shim et al.
patent: 6472741 (2002-10-01), Chen et al.
patent: 6525942 (2003-02-01), Huang et al.
patent: 6528869 (2003-03-01), Glenn et al.
patent: 6528892 (2003-03-01), Caletka et al.
patent: 6541832 (2003-04-01), Coyle
patent: 6545351 (2003-04-01), Jamieson et al.
patent: 6552266 (2003-04-01), Carden et al.
patent: 6552428 (2003-04-01), Huang et al.
patent: 6552430 (2003-04-01), Perez et al.
patent: 6559525 (2003-05-01), Huang
patent: 6563712 (2003-05-01), Akram et al.
patent: 6583513 (2003-06-01), Utagikar et al.
patent: 6583516 (2003-06-01), Hashimoto
patent: 6602732 (2003-08-01), Chen
patent: 6614660 (2003-09-01), Bai et al.
patent: 6617193 (2003-09-01), Toshio et al.
patent: 6657870 (2003-12-01), Ali et al.
patent: 6664617 (2003-12-01), Siu
patent: 6724071 (2004-04-01), Combs
patent: 6724080 (2004-04-01), Ooi et al.
patent: 6906414 (2005-06-01), Zhao et al.
patent: 2001/0001505 (2001-05-01), Schueller et al.
patent: 2001/0005050 (2001-06-01), Ohsawa et al.
patent: 2001/0040279 (2001-11-01), Mess et al.
patent: 2001/0045644 (2001-11-01), Huang
patent: 2002/0053731 (2002-05-01), Chao et al.
patent: 2002/0072214 (2002-06-01), Yuzawa et al.
patent: 2002/0079572 (2002-06-01), Khan et al.
patent: 2002/0096767 (2002-07-01), Cote et al.
patent: 2002/0098617 (2002-07-01), Lee et al.
patent: 2002/0109226 (2002-08-01), Khan et al.
patent: 2002/0171144 (2002-11-01), Zhang et al.
patent: 2002/0180040 (2002-12-01), Camenforte et al.
patent: 2002/0185717 (2002-12-01), Eghan et al.
patent: 2003/0138613 (2003-07-01), Thoman et al.
patent: 2005/0035452 (2005-02-01), Zhang et al.
patent: 0 573 297 (1993-12-01), None
patent: 0 573 297 (1993-12-01), None
patent: 0 504 411 (1998-06-01), None
patent: 0865082 (1998-09-01), None
patent: 2 803 098 (2001-06-01), None
patent: 59-188948 (1984-10-01), None
patent: 61-49446 (1986-03-01), None
patent: 7-283336 (1995-10-01), None
patent: 10-50877 (1996-07-01), None
patent: K10189835 (1996-12-01), None
patent: 10-50877 (1998-02-01), None
patent: 10-247702 (1998-09-01), None
patent: 10-247703 (1998-09-01), None
patent: 11-17064 (1999-01-01), None
patent: 11-102989 (1999-04-01), None
patent: 2001-68512 (1999-08-01), None
patent: 11-307674 (1999-11-01), None
patent: 20000286294 (2000-10-01), None
patent: 383908 (2000-03-01), None
patent: 417219 (2001-01-01), None
Schueller et al., Performance and Reliability of a Cavity Down Tape BGA Package, 1997, pp. 151-162, IEE Electronic Packaging Conference.
English-language Abstract of JP 10-247702, published Sep. 14, 1998, from http://www1.jpdl.jpo.go.jp, 2 pages (last visited Jan. 25, 2002).
U.S. Appl. No. 09/984,259, filed Oct. 29, 2001, Zhao et al.
U.S. Appl. No. 09/997,272, filed Nov. 30, 2001, Zhao et al.
U.S. Appl. No. 09/742,366, filed Dec. 22, 2000, Khan et al.
Ahn, S.H. and Kwon, Y.S., “Popcorn Phenomena in a Ball Grid Array Package”, IEEE Transactions on Components, Packaging, and Manufacturing Technology Part B: Advanced Packaging, IEEE, Aug. 1995, vol. 18, No. 3, pp. 491-496.
Amkor Electronics, “Amkor BGA Packaging: Taking The World By Storm”, Electronic Packaging & Production, Cahners Publishing Company, May 1994, page unknown.
Anderson, L. and Trabucco, B., “Solder Attachment Analysis of Plasti
Khan Reza-ur Rahman
Zhang Tonglong
Broadcom Corporation
Lewis Monica
Sterne Kessler Goldstein & Fox PLLC
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