Heat sink dissipator for adapting to thickness change of a...
Heat sink fin assembly for cooling an LSI package
Heat sink for plastic casings
Heat sink for semiconductor components or similar devices,...
Heat sink for use in cooling an integrated circuit
Heat sink formed of diamond-containing composite material...
Heat sink formed of multiple metal layers on backside of...
Heat sink having good heat dissipating characteristics
Heat sink mounting system for semiconductor devices
Heat sink substrate consisting essentially of copper and...
Heat sink unit for cooling a plurality of exothermic units,...
Heat sink with cooling fins for semiconductor package
Heat sink with preattached thermal interface material and...
Heat spreader
Heat spreader for a multi-chip package
Heat spreader in a flip chip package
Heat spreader semiconductor device with heat spreader and method
Heat spreader with spring IC package
Heat spreader, heat sink, heat exchanger and PDP chassis base
Heat stud for stacked chip package