Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1997-10-31
1999-09-07
Martin-Wallace, Valencia
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257706, 257675, 257783, 257666, H01L 2334, H01L 2310
Patent
active
059491388
ABSTRACT:
A heat spreader (10) is provided for dissipating heat from a semiconductor die (32). The heat spreader (10) comprises a thermally conductive sheet (12) having an aperture (14) formed therein. At least one set of opposing members (20) extends inwardly, but do not contact, within the aperture (14). The opposing members (20) can receive adhesive material for securing the semiconductor die (32) to the heat spreader (10) such that the semiconductor die (32) is disposed over the aperture (14).
REFERENCES:
patent: 5206794 (1993-04-01), Long
patent: 5477081 (1995-12-01), Nagayoshi
patent: 5644164 (1997-07-01), Roh
patent: 5783860 (1998-07-01), Jeng et al.
Arguelles Ronaldo M.
Palasi Primitivo A.
Simon Philip B.
Brady Wade James
Clar Jhihan B
Donaldson Richard L.
Garner Jacqueline J.
Martin-Wallace Valencia
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