Heat spreader in a flip chip package

Details Heat spreader in a flip chip package Heat spreader in a flip chip package

2007-06-25

2009-10-13

Williams, Alexander O (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257SE23101, C257SE21505, C257S737000, C257S738000, C257S778000, C257S712000, C257S717000, C257S720000, C257S713000

Reexamination Certificate

active

07602060

ABSTRACT:
A microelectronic package with enhanced thermal management using an embedded heat spreader is disclosed. The microelectronic package comprises a die mounted on a substrate, a thermal interface material disposed in thermal conductive communication with the die and a heat spreader disposed in thermal conductive communication with the thermal interface material. A mold material is provided to enclose the die and the thermal interface material, and partially embedding the heat spreader to expose at least a surface of the heat spreader to an ambient environment. The heat spreader may include an anchor portion to reinforce coupling of the heat spreader to the mold material. If and when required, the heat spreader may be coupled in thermal communication with an external heat sink.

REFERENCES:
patent: 6212074 (2001-04-01), Gonsalves et al.
patent: 2004/0036172 (2004-02-01), Azuma et al.
patent: 2004/0046241 (2004-03-01), Combs et al.
patent: 2004/0212080 (2004-10-01), Chen et al.
patent: 2005/0056928 (2005-03-01), Kwon et al.
patent: 2005/0167849 (2005-08-01), Sato
patent: 2006/0231944 (2006-10-01), Huang et al.
patent: 2007/0176289 (2007-08-01), Lee et al.
patent: 2007/0270536 (2007-11-01), Sachdev et al.
patent: 2007/0298603 (2007-12-01), Rebibis et al.

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