Heat stud for stacked chip package

Details Heat stud for stacked chip package Heat stud for stacked chip package

2008-04-22

2008-04-22

Im, Junghwa (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S712000, C257S719000, C257S713000, C257S675000, C257S723000, C257S778000

Reexamination Certificate

active

07361986

ABSTRACT:
A semiconductor package assembly is presented. The assembly comprises a first chip and a second chip. The back surfaces of the first and the second chips are thermally attached through a die attach material. The front surface of the first chip is attached to a substrate through bumps. A heat spreader extends from a surface of the semiconductor package assembly into the semiconductor package assembly and thermally attaches to the back surface of the first chip or the front surface of the second chip. Depending on the sizes of the chips and the location of the bonding pads, the heat spreader may be attached to the back surface of the first chip or the front surface of the second chip.

REFERENCES:
patent: 5396403 (1995-03-01), Patel
patent: 6093961 (2000-07-01), McCullough
patent: 6265771 (2001-07-01), Ference et al.
patent: 6472741 (2002-10-01), Chen et al.
patent: 6774478 (2004-08-01), Eto et al.
patent: 6906416 (2005-06-01), Karnezos
patent: 7034388 (2006-04-01), Yang et al.
patent: 2004/0037043 (2004-02-01), Ku
patent: 2004/0113265 (2004-06-01), Karnezos
patent: 2004/0195667 (2004-10-01), Karnezos
patent: 2006/0012018 (2006-01-01), Karnezos et al.

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