Heat spreader semiconductor device with heat spreader and method

Details Heat spreader semiconductor device with heat spreader and method Heat spreader semiconductor device with heat spreader and method

1996-08-09

1998-12-01

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257675, 257746, 257707, 257717, 257720, 257747, H01L 2328, H01L 2329

Patent

active

058443100

ABSTRACT:
A heat spreader for a semiconductor device is constituted by an integral laminate of alternatingly stacked and diffusion-bonded Fe-Ni alloy sheets and copper-group metal sheets, the laminate having a one-directional stripe pattern of the Fe-Ni alloy sheets and the copper-group metal sheets, which appears on a planar surface on which a silicon chip is disposed. It is produced by (a) alternatingly stacking Fe-Ni alloy sheets and copper-group metal sheets, (b) hot isostatic-pressing the resulting stack of the metal sheets to form a slab, (c) rolling the slab vertically to the laminating direction of the metal sheets to form an integrated stripe-pattern laminate, and (d) cutting the integrated stripe-pattern laminate to a predetermined shape.

REFERENCES:
patent: 4810563 (1989-03-01), De Gree et al.
patent: 5681663 (1997-10-01), Schaller et al.

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