Heat spreader for a multi-chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

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Details

C257SE23104, C438S122000, C165S185000

Reexamination Certificate

active

07944046

ABSTRACT:
Embodiments of a heat spreader and an assembly including such a heat spreader are disclosed. The heat spreader includes a stiffening member, which in one embodiment comprises a wall extending from a lower surface of the heat spreader. The wall may be coupled with a substrate, and the addition of this wall may decrease warpage of the substrate and increase package stiffness. The wall may be located between adjacent integrated circuit die that are disposed on the substrate. Other embodiments are described and claimed.

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