Heat spreader, heat sink, heat exchanger and PDP chassis base

Details Heat spreader, heat sink, heat exchanger and PDP chassis base Heat spreader, heat sink, heat exchanger and PDP chassis base

2007-02-13

2007-02-13

Malsawma, Lex H. (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C361S699000

Reexamination Certificate

active

10928893

ABSTRACT:
A heat spreader includes thin films opposite to each other; cooling liquid filling an internal space between the thin films; and a vibration generating means for vibrating the liquid. Accordingly, the heat spreader has excellent heat spread performance compared to a conventional heat spreader, so can have an ultra slim type structure. Also, the heat spreader has excellent heat spread performance regardless of a direction of gravity, and a space between the thin films is sealed in a state of an atmospheric pressure, to maintain the improved heat spread performance for a long time.

REFERENCES:
patent: 3710251 (1973-01-01), Hagge et al.
patent: 5168919 (1992-12-01), Berenholz et al.
patent: 5764483 (1998-06-01), Ohashi et al.
patent: 6658861 (2003-12-01), Ghoshal et al.
patent: 2005/0231914 (2005-10-01), Mikubo et al.
patent: 2002-0083712 (2002-11-01), None
patent: 2003-0042652 (2003-06-01), None

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