LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package,With contact or lead

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Through-silicon via with scalloped sidewalls

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

TO263 device package having low moisture sensitivity

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Transfer material used for producing a wiring substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Transistor module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Transistor module having external lead terminal with transient v

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Transponder incorporated into an electronic device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Tray for ball grid array semiconductor packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Two-sided wafer escape package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

UFBGA package equipped with interface assembly including a photo

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ultra thin, leadless and molded surface mount integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ultra-thin composite package for integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Unique feature design enabling structural integrity for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Universal substrate for a semiconductor device having...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Utilization of die active surfaces for laterally extending...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Utilization of die repattern layers for die internal connections

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Variable rotational assignment of interconnect levels in...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Variable rotational assignment of interconnect levels in...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Variable-width lead interconnection structure and method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Vertical conduction power electronic device package and...