Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2007-09-27
2010-11-23
Monbleau, Davienne (Department: 2893)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S787000, C257SE23043, C257SE23066, C257SE21499
Reexamination Certificate
active
07838980
ABSTRACT:
A lead frame and package construction configured to attain a thin profile and low moisture sensitivity. Lead frames of this invention may include a die attach pad having a die attachment site and an elongate ground lead that extends from the die attach pad. The lead frame includes a plurality of elongate I/O leads arranged about the die attach pad and extending in said first direction. An inventive lead frame features an “up-set” bonding pad electrically connected with the die attach pad and arranged with a bonding support for supporting a plurality of wire bonds. The lead frame also having a large mold flow aperture in the up-set bonding pad. A package incorporating the lead frame is further disclosed such that the package includes an encapsulant that surrounds the bonding support and flows through the large mold flow aperture to establish well supported wire bonds such that the package has low moisture sensitivity.
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Lee Lee Han Meng@Eugene
Lee Yee Kim
Lim Peng Soon
Yii Terh Kuen
Beyer Law Group LLP
Monbleau Davienne
National Semiconductor Corporation
Nguyen Dilinh P
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