LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package,With contact or lead

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Stacked circuit device and method for evaluating an...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Stacked multiple-chip module micro ball grid array packaging

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Stacked package and method for manufacturing the package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Staggered wirebonding configuration

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Standardized power and ground design for pin grid array packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Stitched plane structure and process for package power...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Stress clip design

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Structure and method for fabrication of a leadless chip carrier

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Structure and method of high performance two layer ball grid...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Structure for printed circuit design

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Structure for protecting air bridges on semiconductor chips from

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Structure of a substrate for a high density semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Structure of ceramic package with integrated passive devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Structure of polymer-matrix conductive film and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Stud bumps for die alignment

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Substrate connector for integrated circuit devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Substrate design to improve chip package reliability

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Substrate for an integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Substrate for an integrated circuit package and a method of...