Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2004-11-30
2009-10-06
Clark, Jasmine J (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S040000, C257S690000, C257S734000, C257S748000, C257S751000, C257S753000, C257S773000, C257S776000, C257S792000, C257SE23007, C257SE21627, C257SE21641, C174S255000, C174S261000, C174S262000
Reexamination Certificate
active
07598609
ABSTRACT:
A composite conductive film formed of a polymer-matrix and a plurality of conductive lines less than micro-sized and its fabricating method are provided. The conductive lines are arranged parallel and spaced apart from each other so as to provide anisotropic conductivity. The present conductive film can serve as an electrical connection between a fine-pitch chip and a substrate. Additionally, an adhesive layer is formed on two opposite sides of the conductive film along its conductive direction to increase adhesive areas. The strength and reliability of the package using the conductive film are thus enhanced.
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Chen Yu Chih
Cheng Syh Yuh
Lin Ren Jay
Uang Ruoh Huey
Bacon & Thomas PLLC
Clark Jasmine J
Industrial Technology Research Institute
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