Stacked package and method for manufacturing the package

Details Stacked package and method for manufacturing the package Stacked package and method for manufacturing the package

2011-04-19

2011-04-19

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S686000, C257SE23024

Reexamination Certificate

active

07928557

ABSTRACT:
In a stacked package in which a plurality of packages having semiconductor elements mounted on substrates are stacked, while being electrically connected together, by use of connection sections, wherein the connection sections are formed from pillar-like members and solder joint sections and the upper package is supported on the lower package by pillar-like members.

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patent: 2004/0007774 (2004-01-01), Crane et al.
patent: 2006/0289977 (2006-12-01), Master et al.
patent: 2007/0235856 (2007-10-01), Haba et al.
patent: 11-8474 (1999-01-01), None

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