Stacked multiple-chip module micro ball grid array packaging

Details Stacked multiple-chip module micro ball grid array packaging Stacked multiple-chip module micro ball grid array packaging

1999-03-17

2000-02-08

Nguyen, Viet Q.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257704, 257668, 257698, 257791, 257773, 365 51, H01L 2312

Patent

active

060230975

ABSTRACT:
A micro ball grid array package is devised for a multiple-chip module (MCM). The IC chips in the package are stacked to save space. The bonding pads for the lower IC chip or chips are placed along the edges where the pads are not masked by the stacking of the upper chip or chips. When there are more than one chip at each level of the stacking, the IC chips at each level are butted with each other to further save space. The bonding pads of the chips are wire-bonded to a printed wiring plate, which has via holes through the printed wiring plate for connection to the ball grid array at the other side of the printed wiring plate and for surface mounting to a printed circuit board. A heat dissipating plate may be inserted at the bottom of the IC chips away from the stacking surface.

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