Structure for protecting air bridges on semiconductor chips from

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

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257725, 257758, 257659, 257684, 257723, 257704, 257522, 361795, B23K 2600, H05K 330, H01L 2934, H01L 2348

Patent

active

057570728

ABSTRACT:
A protective cap is deposited over the top and sides of an air bridge structure located on an integrated circuit chip. The protective cap provides mechanical strength during the application of a high density interconnect structure over the chips, to prevent deformation of the sensitive (air bridge) structure, and also to prevent any contamination from intruding under the air bridge. More importantly, the protective cap does not impede the performance of the air bridge and therefore does not need to be removed, thereby eliminating the necessity of ablating the HDI structure. Furthermore, the protective cap allows additional area for metallization to provide alternate circuits for coupling, power or ground planes, etc.

REFERENCES:
patent: 5049978 (1991-09-01), Bates et al.
patent: 5073814 (1991-12-01), Cole, Jr. et al.
patent: 5151769 (1992-09-01), Immorlica, Jr. et al.
patent: 5359496 (1994-10-01), Kornrumpf et al.
patent: 5524339 (1996-06-01), Gorowitz et al.
patent: 5548099 (1996-08-01), Cole, Jr. et al.

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