LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package,With contact or lead

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Contact structure and production method thereof and probe...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Contact structure for IC socket

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Contact structure formed by microfabrication process

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Contact structure, display device and electronic device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Contact system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Controlled impedence interposer substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Controlling impedances of an integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Coplanar linear dual switch module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Corrosion-resistant copper bond pad and integrated device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Coupling substrate for semiconductor components and method...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Cover substrate attached to a rim substrate with...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Crosstalk reduction in electrical interconnects using...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

CSP stacking technology using rigid/flex construction

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

CSP type semiconductor device with reduced package size

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Cu-balanced substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Current sense element incorporated into integrated circuit packa

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Current supply and support system for a thin package