Controlling impedances of an integrated circuit

Details Controlling impedances of an integrated circuit Controlling impedances of an integrated circuit

1997-12-08

1999-12-28

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257664, 257723, H01L 2352

Patent

active

060085339

ABSTRACT:
A semiconductor assembly includes two leads, a primary die and a secondary support structure. Impedance networks of the secondary support structure establish an impedance between each lead and a different bond pad of the primary die. Although the distances between each bond pad and lead are substantially different, the impedances between each bond pad and lead are substantially the same.

REFERENCES:
patent: 4393392 (1983-07-01), Hale
patent: 4720915 (1988-01-01), Kennedy et al.
patent: 4751482 (1988-06-01), Fukuta et al.
patent: 5006673 (1991-04-01), Freyman et al.
patent: 5371405 (1994-12-01), Kagawa
patent: 5616952 (1997-04-01), Nakano et al.
patent: 5677570 (1997-10-01), Kondoh et al.
patent: 5789816 (1998-08-01), Wu

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