Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2008-03-20
2011-10-25
Louie, Wai Sing (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S081000, C257S099000, C257S688000, C257S700000, C257SE21506
Reexamination Certificate
active
08044501
ABSTRACT:
A contact that takes a structure to laminate a protective conductive film over a metal film has a high hardness of the protective conductive film; therefore, a damage of contact surface made by contacting with an electrode of an inspection apparatus can be prevented in an inspection before boding FPC. However, the protective conductive film has higher resistivity compared to the metal film; therefore, contact resistivity with FPC gets higher, and power consumption gets bigger in the condition of using the display device. The present invention provides a contact structure, wherein a structure of FPC contact is formed of a layered film of the metal film and the protective conductive film, and a conductive particle included in an anisotropic conductive film is formed of the protective conductive film in a slit shape having a space wider than a width necessary for an electrical connection with the metal film and a space narrower than a width of an electrode of an inspection apparatus and can be electrically connected with the FPC in both of the protective conductive film and the metal film, and a display device having the contact structure.
REFERENCES:
patent: 4780794 (1988-10-01), Mase et al.
patent: 4820612 (1989-04-01), Mase et al.
patent: 4828967 (1989-05-01), Mase et al.
patent: 5608559 (1997-03-01), Inada et al.
patent: 5636329 (1997-06-01), Sukegawa et al.
patent: 5821159 (1998-10-01), Ukita
patent: 5904860 (1999-05-01), Nagakubo et al.
patent: 6043859 (2000-03-01), Maeda
patent: 6051883 (2000-04-01), Nakamura
patent: 6072556 (2000-06-01), Hirakata et al.
patent: 6169593 (2001-01-01), Kanaya et al.
patent: 6215077 (2001-04-01), Utsumi et al.
patent: 6239854 (2001-05-01), Hirakata et al.
patent: 6383327 (2002-05-01), Mase
patent: 6404476 (2002-06-01), Mase
patent: 6567146 (2003-05-01), Hirakata et al.
patent: 6670940 (2003-12-01), Kim
patent: 6729888 (2004-05-01), Imaeda
patent: 6760091 (2004-07-01), Uehara
patent: 7361027 (2008-04-01), Ebine
patent: 7411211 (2008-08-01), Yamazaki
patent: 2002/0189862 (2002-12-01), Miyake et al.
patent: 8-227079 (1996-09-01), None
patent: 11-125837 (1999-05-01), None
patent: 2001-93598 (2001-04-01), None
Husch & Blackwell LLP
Louie Wai Sing
Semiconductor Energy Laboratory Co,. Ltd.
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