Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2005-02-15
2005-02-15
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S692000, C257S693000, C257S718000, C257S719000, C257S730000, C257S731000, C257S177000
Reexamination Certificate
active
06856012
ABSTRACT:
The power semiconductor includes a module housing having a conductive cover plate and a conductive baseplate and also an insulating housing wall arranged between the cover plate and the baseplate. A power semiconductor circuit is accommodated in the module housing. Two terminals of the power semiconductor circuit are led out of the module housing, a first of the at least two terminals being provided for the contact connection of the cover plate. The two terminals are arranged on opposite areas of a printed circuit board led out of the module housing, which printed circuit board can be contact-connected by means of a standard connector. The power semiconductor module according to the invention has improved contacts with regard to stability and inductance.
REFERENCES:
patent: 4710795 (1987-12-01), Nippert et al.
patent: 4748495 (1988-05-01), Kucharek
patent: 5579217 (1996-11-01), Deam et al.
patent: 5705853 (1998-01-01), Faller et al.
patent: 6313598 (2001-11-01), Tamba et al.
patent: 196 03 224 (1997-07-01), None
patent: 0 772 235 (1997-05-01), None
International Preliminary Examination Report dated Feb. 4, 2003.
ABB (Schweiz) AG
Burns Doane Swecker & Mathis L.L.P.
Parekh Nitin
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