Contact structure for IC socket

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

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Details

257727, 257778, H01L 2348

Patent

active

056464428

ABSTRACT:
A contact structure for an IC socket is usable for an IC package having a number of spherical type terminals or a number of cylindrical terminals arranged on the lower surface of an IC main body. To realize this contact structure for an IC socket, a number of contacts arranged corresponding to the spherical type terminals or the cylindrical terminals on the IC main body are provided. Resilient contact pieces for allowing each contact to come into pressure contact with each terminal at one point or at two points on the peripheral surface of the respective terminals are provided. Plural groups are constructed for a group of contacts and a group of terminals for changing an orientation of each resilient contact piece for allowing the group of contacts to give pressure contact force to the group of terminals in three directions or four directions. Each of the plural groups is arranged to generate an opposing force between adjacent groups.

REFERENCES:
patent: 2958064 (1960-10-01), Swengel
patent: 5164818 (1992-11-01), Blum et al.

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