Corrosion-resistant copper bond pad and integrated device

Details Corrosion-resistant copper bond pad and integrated device Corrosion-resistant copper bond pad and integrated device

2006-07-18

2006-07-18

Owens, Douglas W (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S736000, C438S612000

Reexamination Certificate

active

07078796

ABSTRACT:
The invention provides an integrated device with corrosion-resistant capped copper bond pads. The capped copper bond pads include at least one copper bond pad on a semiconductor substrate. An activation layer comprising one of immersion palladium, electroless cobalt, or immersion ruthernium is disposed on the copper bond pad. A first intermediate layer of electroless nickel-boron alloy is disposed on the activation layer. A second intermediate layer comprising one of electroless nickel or electroless palladium is disposed on the first intermediate layer, and an immersion gold layer is disposed on the second intermediate layer. A capped copper bond pad and a method of forming the capped copper bond pads are also disclosed.

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patent: 1 096 243 (2001-05-01), None
patent: 1 096 243 (2002-06-01), None

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